Power chips are connected to outside circuits via product packaging, and their performance depends upon the assistance of the product packaging. In high-power situations, power chips are generally packaged as power modules. Chip interconnection describes the electric link on the top surface of the chip, which is generally light weight aluminum bonding cord in traditional modules. ^ Conventional power component plan cross-section

Presently, commercial silicon carbide power components still primarily make use of the packaging innovation of this wire-bonded standard silicon IGBT component. They deal with issues such as big high-frequency parasitical parameters, insufficient warmth dissipation capability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The display screen of exceptional performance. In order to address these troubles and totally make use of the substantial potential benefits of silicon carbide chips, several brand-new product packaging innovations and solutions for silicon carbide power components have actually arised recently.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually developed from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cables to copper cords, and the driving force is expense decrease; high-power devices have actually created from aluminum wires (strips) to Cu Clips, and the driving force is to improve item efficiency. The greater the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding product packaging techniques, Cu Clip technology has the following advantages:

1. The connection in between the chip and the pins is made from copper sheets, which, to a particular level, replaces the standard wire bonding approach in between the chip and the pins. Consequently, an one-of-a-kind plan resistance worth, higher present circulation, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can totally save the expense of silver plating and poor silver plating.

3. The product look is completely constant with regular products and is primarily utilized in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding method is much more expensive and complicated, however it can achieve better Rdson and far better thermal effects.

( copper strip)

Copper sheet plus cord bonding technique

The source pad utilizes a Clip method, and eviction makes use of a Cable method. This bonding method is somewhat less expensive than the all-copper bonding approach, conserving wafer location (applicable to very little entrance areas). The process is simpler than the all-copper bonding technique and can acquire better Rdson and far better thermal impact.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper bottle, please feel free to contact us and send an inquiry.